Company Filing History:
Years Active: 2018-2021
Title: Innovations by Lan Peng in Semiconductor Bonding
Introduction
Lan Peng is a notable inventor based in Leuven, Belgium, recognized for his contributions to semiconductor technology. He holds two patents that focus on advanced methods of bonding semiconductor substrates, which are crucial for the integration of semiconductor dies.
Latest Patents
His latest patents include a method of bonding semiconductor substrates that involves providing a first and a second substrate, each comprising a dielectric bonding layer. This method includes pre-treating the dielectric bonding layers through a series of plasma activation processes and wet surface treatments before bonding the substrates. The second patent also describes a direct bonding method for semiconductor substrates, which emphasizes the importance of reducing the roughness of dielectric layers and achieving excellent bond strength at lower annealing temperatures.
Career Highlights
Lan Peng is currently associated with Imec Vzw, a leading research institution in nanoelectronics and digital technologies. His work has significantly advanced the field of semiconductor bonding, making it more efficient and effective.
Collaborations
He collaborates with esteemed colleagues such as Soon-Wook Kim and Eric Beyne, contributing to innovative research and development in semiconductor technologies.
Conclusion
Lan Peng's work in semiconductor bonding showcases his expertise and commitment to advancing technology in this critical field. His patents reflect significant innovations that enhance the performance and reliability of semiconductor devices.