Lan-Chin Chiou

Title: Innovations by Lan-Chin Chiou

Introduction

Lan-Chin Chiou is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of thermal management in electronic devices. His innovative designs focus on improving the efficiency and performance of thermal modules.

Latest Patents

Lan-Chin Chiou holds 1 patent for his invention related to thermal modules for electronic devices. This patent describes a thermal module that includes a first heatsink with a first airflow exit. The first heatsink features a first set of fins with a greater height and a second set of fins with a lesser height. The second set of fins is positioned adjacent to the first airflow exit. Additionally, a second heatsink defines a second airflow exit and is spaced from the first heatsink, creating a gap between them. The second heatsink is thermally coupled to the first heatsink through a heat pipe, enhancing the thermal management of electronic devices.

Career Highlights

Lan-Chin Chiou is currently employed at Hewlett-Packard Development Company, L.P. His work at this esteemed company has allowed him to focus on developing advanced thermal solutions for various electronic applications. His expertise in thermal management has positioned him as a valuable asset in the field.

Collaborations

Throughout his career, Lan-Chin Chiou has collaborated with talented individuals such as Shaheen Saroor and Hung-Ming Lin. These collaborations have fostered innovation and contributed to the development of cutting-edge technologies in thermal management.

Conclusion

Lan-Chin Chiou's contributions to the field of thermal modules for electronic devices demonstrate his commitment to innovation and excellence. His patent reflects a deep understanding of thermal dynamics, which is crucial for the advancement of electronic technology.