Hewlett-Packard Development Company, L.p.

Lan-Chin Chiou

Shaheen Saroor

Hung-Ming Lin

Example thermal modules are disclosed. An example thermal module for use with an electronic device includes a first heatsink defining a first airflow exit. The first heatsink including a first set of fins having a first height and a second set of fins having a second height. The second height being less than the first height. The second set of fins being adjacent the first airflow exit. A second heatsink defines a second airflow exit. The second heatsink is spaced from the first heatsink to form a gap therebetween. The second heatsink is thermally coupled to the first heatsink via a heat pipe.

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Taipei, Taiwan

Lan-Chin Chiou