Lajos Burgyan

Title: Lajos Burgyan: Innovator in Semiconductor Packaging

Introduction

Lajos Burgyan is a prominent inventor based in Mountain View, CA (US). He has made significant contributions to the field of semiconductor packaging, holding a total of 9 patents. His work focuses on innovative techniques that enhance the efficiency and scalability of electronic components.

Latest Patents

Among his latest patents is the "Panel-level package fabrication of 3D active semiconductor and passive circuit components." This invention describes three-dimensional Panel-Level Packaging (3D-PLP) fabrication techniques for mass production of compact electronic component packages, such as DC-DC converters. Each package consists of at least one active semiconductor die and a passive electrical circuit element, such as a capacitor, inductor, or resistor. Another notable patent is related to "Power convertor device and construction methods." This invention pertains to integrated circuit (IC) packages, specifically focusing on IC power converter technologies. It emphasizes scalability for high voltage or current levels, effective heat dissipation, and adaptability for rapid prototyping.

Career Highlights

Lajos Burgyan has worked with Fairchild Semiconductor Corporation, where he contributed to advancements in semiconductor technology. His experience in the industry has allowed him to develop innovative solutions that address the challenges faced in electronic component packaging.

Collaborations

Throughout his career, Lajos has collaborated with notable professionals, including James Zeng and Rendon A Holloway. These partnerships have fostered a creative environment that has led to groundbreaking inventions in the semiconductor field.

Conclusion

Lajos Burgyan's contributions to semiconductor packaging and his innovative patents have significantly impacted the electronics industry. His work continues to inspire advancements in technology and efficiency in electronic components.