LaiMing Lim

Title: Innovations by LaiMing Lim in Adhesive Circuit Patterning

Introduction

LaiMing Lim is an innovative inventor based in Penang, Malaysia. He has made significant contributions to the field of flexible and stretchable electronics. His work focuses on enhancing the durability and functionality of printed circuit traces and adhesive bonded joints.

Latest Patents

LaiMing Lim holds a patent for an "Adhesive Circuit Patterning Process." This patent discloses processes and materials that strengthen and protect printed circuit traces and adhesive bonded joints of surface-mounted devices. The method involves depositing a circuit pattern on a thermal adhesive film. One or more surface-mounted devices are then attached to a cured printed circuit to form an assembled printed circuit. This assembled circuit can be placed on a stretchable substrate. The thermal adhesive film is melted on the assembled printed circuit and the stretchable substrate to protect and reinforce joint bonds and the circuit pattern in a single melting or curing step. He has 1 patent to his name.

Career Highlights

LaiMing Lim is currently employed at Jabil Inc., where he continues to develop innovative solutions in electronics. His work has been instrumental in advancing the capabilities of flexible electronics, making them more reliable and efficient.

Collaborations

LaiMing Lim collaborates with his coworker, Zambri Bin Samsudin, to further enhance their research and development efforts in the field of electronics.

Conclusion

LaiMing Lim's contributions to adhesive circuit patterning represent a significant advancement in the field of flexible electronics. His innovative methods and processes are paving the way for more durable and efficient electronic devices.