Taipei, Taiwan

Lai Wang Cai

This inventor holds 1 USPTO granted patent. Top assignee: Wiwynn Corporation. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Lai Wang Cai. Retrieved from https://idiyas.com/inventor/lai-wang-cai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Innovations of Lai Wang Cai

Introduction

Lai Wang Cai is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of technology, particularly with his innovative designs and patents. His work reflects a commitment to advancing engineering solutions that enhance functionality and efficiency.

Latest Patents

Lai Wang Cai holds a patent for a "Support assembly and rack module." This invention is designed to be mounted in a rack and includes a support casing with at least one release mechanism. The support casing is formed with at least one hole, and the release mechanism features a slidable component and at least one plunger. The plunger is designed to engage with the rack, providing a reliable and efficient support system.

Career Highlights

Lai Wang Cai is currently employed at Wiwynn Corporation, where he continues to innovate and develop new technologies. His work at the company has allowed him to collaborate with other talented professionals in the field, further enhancing his contributions to the industry.

Collaborations

One of his notable coworkers is Wei Chen Lin, with whom he has likely shared insights and expertise in their respective projects.

Conclusion

Lai Wang Cai's innovative spirit and dedication to engineering excellence are evident in his patent and ongoing work at Wiwynn Corporation. His contributions continue to shape the future of technology in meaningful ways.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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