Company Filing History:
Years Active: 2007
Title: Innovations by Lai Wa Helen Chan
Introduction
Lai Wa Helen Chan is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of bonding technology. His innovative approach has led to the development of a unique apparatus and method for aligning bonding tools.
Latest Patents
Lai Wa Helen Chan holds a patent for an "Apparatus and method for alignment of a bonding tool." This invention provides a sophisticated solution for aligning bonding tools through the use of a force sensor. The force sensor is equipped with multiple force sensing sections that measure the force generated by the bonding tool. Each sensing section is designed to detect the amount of force from a specific part of the bonding tool, allowing for precise alignment determination.
Career Highlights
Lai Wa Helen Chan is currently employed at Asm Assembly Automation Limited, where he continues to innovate in the field of assembly automation. His work has been instrumental in enhancing the efficiency and accuracy of bonding processes.
Collaborations
Lai Wa Helen Chan collaborates with talented individuals such as Siu Hong Choy and Chou Kee Peter Liu. Their combined expertise contributes to the advancement of technology in their field.
Conclusion
Lai Wa Helen Chan's contributions to bonding technology through his innovative patent demonstrate his commitment to advancing the industry. His work at Asm Assembly Automation Limited and collaborations with skilled colleagues further highlight his impact on the field.