This inventor holds 2 USPTO granted patents. Top assignee: Quanta Computer Incorporated. Active years: 2015-2018.
Location History:
- Pingzhen, TW (2015)
- Taoyuan, TW (2018)
Company Filing History:
Years Active: 2015-2018
Title: Innovations of Lai-Peng Lai
Introduction
Lai-Peng Lai is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of technology, particularly in the development of advanced bonding methods and curing equipment. With a total of 2 patents, his work showcases innovative solutions that enhance manufacturing processes.
Latest Patents
Lai-Peng Lai's latest patents include a substrate-bonding device and a method of the same. This method involves several steps, such as providing a curved glass substrate and a flexible light-transmissive film. The process includes moving a roller to press the film onto the substrate, ensuring that it matches the curvature of the glass. Additionally, the method incorporates sensing the attaching level of the film and adjusting the press force accordingly. Another significant patent is the glue-thermal curing equipment, which consists of a chassis, support, heating baking plate, and a lifting device. This equipment allows for uniform thermal energy distribution to a liquid-state glue layer, enhancing the curing process.
Career Highlights
Lai-Peng Lai is associated with Quanta Computer Incorporated, a leading company in the technology sector. His work at Quanta has allowed him to focus on innovative solutions that address industry challenges. His contributions have been instrumental in advancing the company's technological capabilities.
Collaborations
Lai-Peng Lai has collaborated with notable coworkers, including Ching-Chih Chen and Lin-Huei Wang. These collaborations have fostered a creative environment that encourages the development of groundbreaking technologies.
Conclusion
Lai-Peng Lai's innovative patents and contributions to Quanta Computer Incorporated highlight his role as a significant inventor in the technology field. His work continues to influence advancements in manufacturing processes and equipment design.