This inventor holds 1 USPTO granted patent. Top assignees: Korea Advanced Institute of Science and Technology, Lg Innotek Co., Ltd.. Active years: 2015.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
1 out of 2,792 
1 out of 5,406 
Years Active: 2015
Title: Kyuong-wook Paik: Innovator in PCB Bonding Technology
Introduction
Kyuong-wook Paik is a notable inventor based in Daejeon, South Korea. He has made significant contributions to the field of technology, particularly in the area of bonding flexible printed circuit boards (PCBs) to camera modules. His innovative approach has led to the development of a unique device that enhances the efficiency and effectiveness of this bonding process.
Latest Patents
Kyuong-wook Paik holds a patent for a "Device for bonding flexible PCB to camera module." This device utilizes a thermo-compression unit to bond the camera module to the flexible PCB using a conductive film. The process involves applying heat and pressure to the conductive film, ensuring a strong connection. Additionally, the device features an ultrasonic wave bonding unit that transmits ultrasonic wave vibration energy to the camera module. This action removes any oxide film on connection particles formed within the conductive film. A controller is also included, which activates the ultrasonic wave bonding unit when the temperature of the conductive film reaches a predetermined level. This innovative technology has the potential to improve the reliability and performance of camera modules in various applications.
Career Highlights
Throughout his career, Kyuong-wook Paik has worked with prestigious organizations, including the Korea Advanced Institute of Science and Technology and LG Innotek Co., Ltd. His experience in these institutions has allowed him to refine his skills and contribute to groundbreaking advancements in technology.
Collaborations
Kyuong-wook Paik has collaborated with talented individuals such as Yoo Sun Kim and Kiwon Lee. These partnerships have fostered a creative environment that encourages innovation and the development of new technologies.
Conclusion
Kyuong-wook Paik is a distinguished inventor whose work in bonding technology has made a significant impact in the field. His patent for a device that bonds flexible PCBs to camera modules showcases his innovative spirit and dedication to advancing technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile