Yongin, South Korea

Kyung-soon Bok

This inventor holds 1 USPTO granted patent. Top assignee: Samsung Aerospace Industries, Ltd.. Active years: 2000.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kyung-soon Bok. Retrieved from https://idiyas.com/inventor/kyung-soon-bok

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 19(Granted Patents)


Company Filing History:


Years Active: 2000

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Kyung-soon Bok

Introduction

Kyung-soon Bok is a notable inventor based in Yongin, South Korea. She has made significant contributions to the field of engineering, particularly in the development of advanced lead frame technologies. Her work has implications for various applications in the electronics industry.

Latest Patents

Kyung-soon Bok holds a patent for a multi-layer plated lead frame. This innovative lead frame features a structure where a first precious metal plating layer, an intermediate plating layer, and a second precious metal plating layer are sequentially formed on a substrate made of ferroalloy. The design of this lead frame enhances properties such as wire bonding, anti-corrosion, and solderability, making it a valuable advancement in the field.

Career Highlights

Kyung-soon Bok is currently employed at Samsung Aerospace Industries, Ltd., where she continues to push the boundaries of technology. Her expertise and innovative mindset have positioned her as a key player in her field.

Collaborations

Throughout her career, Kyung-soon Bok has collaborated with talented individuals such as Joong-do Kom and Young-ho Baek. These partnerships have fostered an environment of creativity and innovation, leading to the development of groundbreaking technologies.

Conclusion

Kyung-soon Bok's contributions to the field of engineering, particularly through her patented multi-layer plated lead frame, demonstrate her commitment to innovation. Her work not only enhances the performance of electronic components but also showcases the importance of collaboration in achieving technological advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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