Kyoung-mok Son

Title: Kyoung-mok Son and His Integrated Circuit Bonding Pad Patent.

Introduction

Kyoung-mok Son is an inventor associated with Samsung Electronics Co., Ltd. in Seoul, South Korea. His patent work includes a design for integrated circuit bonding pads that uses conductive layers and insulating islands.

Latest Patents

The provided information lists one patent for Son: “Integrated Circuit Bonding Pads Including Conductive Layers with Arrays of Unaligned Spaced Apart Insulating Islands Therein and Methods of Forming Same.” The invention describes bonding pads with two spaced-apart conductive layers and a continuous conductive layer between them. An array of spaced-apart insulating islands extends through the continuous layer, with the layer surrounding the islands’ sidewalls. The islands can be arranged in rows and columns, with neighboring islands positioned so their edges are unaligned. The design concerns the structure and formation of bonding pads for integrated circuits. Son is credited with 1 patent in the information provided.

Career Highlights

Son’s listed patent reflects work on semiconductor interconnect structures and integrated circuit packaging. The described arrangement combines conductive layers with patterned insulating regions within a bonding pad.

Collaborations

The provided information names Son-jong Wang and Jong-hyon Ahn as Son’s coworkers. It does not specify their roles in the patent or describe particular collaborative contributions.

Conclusion

Kyoung-mok Son’s listed invention focuses on a layered integrated circuit bonding pad with unaligned insulating islands, highlighting his contribution to semiconductor technology at Samsung Electronics.