Kyong Hwan Koh

Title: Kyong Hwan Koh: Innovator in Semiconductor Packaging

Introduction

Kyong Hwan Koh is a prominent inventor based in Asan-si, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 6 patents. His work focuses on innovative designs that enhance the functionality and efficiency of semiconductor devices.

Latest Patents

Kyong Hwan Koh's latest patents include a semiconductor package that features a substrate with at least one ground pad and a ground pattern. This design incorporates a semiconductor chip on the substrate and a shield layer that covers the chip, extending onto the bottom surface of the substrate. The shield layer is designed to ensure optimal performance by maintaining contact with the ground pad and ground pattern. Another notable patent involves a semiconductor package that includes a base substrate with a plurality of recesses and a molding member with protrusions that fill these recesses. This design enhances the structural integrity and performance of the semiconductor package.

Career Highlights

Kyong Hwan Koh is currently employed at Samsung Electronics Co., Ltd., a leading company in the technology sector. His work at Samsung has allowed him to push the boundaries of semiconductor technology and contribute to advancements in the industry.

Collaborations

Throughout his career, Kyong Hwan Koh has collaborated with talented individuals such as Jongho Park and Seung Hwan Kim. These collaborations have fostered innovation and have led to the development of cutting-edge semiconductor solutions.

Conclusion

Kyong Hwan Koh is a distinguished inventor whose work in semiconductor packaging has made a significant impact on the industry. His innovative patents and collaborations with other experts highlight his commitment to advancing technology.