Incheon-shi, South Korea

Kyong Hoon Youn


Average Co-Inventor Count = 7.0

ph-index = 2

Forward Citations = 172(Granted Patents)


Company Filing History:


Years Active: 2005-2006

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2 patents (USPTO):Explore Patents

Title: Kyong Hoon Youn: Innovator in Semiconductor Technology

Introduction

Kyong Hoon Youn is a notable inventor based in Incheon-shi, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on enhancing the functionality and efficiency of semiconductor packages.

Latest Patents

One of his latest patents is a semiconductor package with an increased number of input and output pins. This invention includes a generally planar die paddle that defines multiple peripheral edge segments and features at least two slots formed within it. The semiconductor package comprises a plurality of first leads, segregated into at least two sets, which are disposed within the slots of the die paddle. Additionally, it includes a plurality of second leads, also segregated into at least two sets, extending along respective peripheral edge segments of the die paddle. The design allows for efficient electrical connections to a semiconductor die, which is encapsulated within the package body, ensuring that the bottom surfaces of the die paddle and first leads are exposed in a common exterior surface.

Career Highlights

Kyong Hoon Youn is currently employed at Amkor Technology, Inc., a leading provider of semiconductor packaging and test services. His innovative work has contributed to advancements in semiconductor technology, making significant impacts in the industry.

Collaborations

He has collaborated with notable coworkers, including Choon Heung Lee and Donald Craig Foster, to further enhance the development of semiconductor technologies.

Conclusion

Kyong Hoon Youn's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the field. His work continues to shape the future of semiconductor packaging and functionality.

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