Kyong Bok Min

Title: Kyong Bok Min: Innovator in Wafer Level Packaging and Electrostatic Discharge Protection

Introduction

Kyong Bok Min is a prominent inventor based in Gyunggi-do, South Korea. He has made significant contributions to the field of electronics, particularly in the development of advanced packaging technologies. With a total of 7 patents to his name, Min has established himself as a key figure in innovation.

Latest Patents

Among his latest patents is a wafer level package and method of manufacturing the same. This invention features a wafer member with inner cavities for circuit elements, element wall members that enclose these elements, and clearance wall members that divide the space into clearance sections. Another notable patent is for an electrostatic discharge protection device and method for manufacturing the same. This device includes a base with multiple electrodes, a function layer, and a composite insulating layer that enhances protection against electrostatic discharge.

Career Highlights

Kyong Bok Min is currently employed at Samsung Electro-Mechanics Co., Ltd., where he continues to push the boundaries of technology. His work has been instrumental in advancing the capabilities of electronic components, making them more efficient and reliable.

Collaborations

Min has collaborated with notable colleagues, including Eon Soo Lee and Hong Ryul Lee, contributing to various projects that enhance the functionality and performance of electronic devices.

Conclusion

Kyong Bok Min's innovative work in wafer level packaging and electrostatic discharge protection showcases his expertise and commitment to advancing technology. His contributions are vital to the ongoing evolution of electronic components.