The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2019
Filed:
Apr. 05, 2016
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Moon Chul Lee, Suwon-si, KR;
Duck Hwan Kim, Suwon-si, KR;
Yeong Gyu Lee, Suwon-si, KR;
Jae Chang Lee, Suwon-si, KR;
Tae Yoon Kim, Suwon-si, KR;
Kyong Bok Min, Suwon-si, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); B81C 1/00 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/007 (2013.01); B81C 1/00269 (2013.01); H01L 23/00 (2013.01); B81B 2201/0271 (2013.01); B81B 2203/0315 (2013.01); B81C 2203/0118 (2013.01);
Abstract
A wafer level package includes a wafer member having inner cavities in which circuit elements are disposed, element wall members disposed on an internal surface of the wafer member and enclosing element sections in which the circuit elements are disposed, and clearance wall members disposed on external surfaces of the element wall members and dividing a space between the element sections into clearance sections.