Company Filing History:
Years Active: 2020
Title: Kyohei Yoshida: Innovator in Polishing Compositions
Introduction
Kyohei Yoshida is a notable inventor based in Mie, Japan. He has made significant contributions to the field of chemical engineering, particularly in the development of polishing compositions for semiconductor manufacturing.
Latest Patents
Yoshida holds a patent for "Aqueous compositions of low dishing silica particles for polysilicon polishing." This invention provides aqueous chemical mechanical planarization (CMP) polishing compositions that include a mixture of alkoxylated diamines, aqueous dispersions of colloidal silica particles, and ammonia or an amine base. The compositions are designed to be substantially free of metals that can damage substrates during polishing, ensuring a high-quality finish.
Career Highlights
Kyohei Yoshida has worked with Rohm and Haas Electronic Materials CMP Holdings, Inc., where he has applied his expertise in developing innovative polishing solutions. His work has been instrumental in advancing the technology used in semiconductor manufacturing processes.
Collaborations
Yoshida has collaborated with several professionals in his field, including Naresh Kumar Penta and Matthew Richard Van Hanehem. These collaborations have contributed to the successful development of his patented technologies.
Conclusion
Kyohei Yoshida's contributions to the field of polishing compositions highlight his innovative spirit and dedication to advancing semiconductor manufacturing technology. His work continues to influence the industry positively.