Kwan Sik Chung

Title: Kwan Sik Chung: Innovator in Electronic Product Design

Introduction

Kwan Sik Chung is a notable inventor based in Sungnam-si, South Korea. He has made significant contributions to the field of electronic product design, particularly in minimizing warpage in electronic components. His innovative approach has led to the development of a unique method that enhances the reliability and performance of electronic products.

Latest Patents

Kwan Sik Chung holds a patent for a "Method for controlling warpage within electronic products and an electronic product." This invention discloses a method for minimizing warpage in electronic products, along with the structures of such products. The method involves forming groove holes into the insulating material layer or several layers, which can be processed by laser drilling or other suitable means. A cured epoxy adhesive fills these groove holes after heat and pressure treatment is applied to the circuit structure. The electronic product may consist of multiple insulating layers and embedded electronic components connected to a wiring layer. Additionally, the invention allows for the manufacturing of double-stacked symmetrical structures and asymmetrical structures with different sized embedded components. The groove holes can be shaped in various forms, including straight short lines, ellipses, crosses, circles, or any combination of different shapes.

Career Highlights

Kwan Sik Chung is currently associated with Ge Embedded Electronics Oy, where he continues to innovate and contribute to the advancement of electronic product technology. His work focuses on improving the structural integrity and functionality of electronic devices, making them more efficient and reliable.

Collaborations

Due to space constraints, the collaborations section has been omitted.

Conclusion

Kwan Sik Chung's innovative methods for controlling warpage in electronic products represent a significant advancement in the field of electronics. His contributions not only enhance product performance but also pave the way for future innovations in electronic design.