Herisau, Switzerland

Kurt Stephan


Average Co-Inventor Count = 2.8

ph-index = 3

Forward Citations = 30(Granted Patents)


Company Filing History:


Years Active: 1994-2002

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3 patents (USPTO):Explore Patents

Title: Innovations by Kurt Stephan in Optical Fiber Technology

Introduction

Kurt Stephan is a notable inventor based in Herisau, Switzerland. He has made significant contributions to the field of optical fiber technology, holding a total of three patents. His work focuses on methods and adhesives that enhance the performance and reliability of optical connections.

Latest Patents

Kurt Stephan's latest patents include a method for fixing an optical fiber cable in a connector for a connectable optical fiber connection. This method involves inserting the optical fiber into a bore hole of a connector's location body and securing it with a solid chemically reactive adhesive. This adhesive, when brought into a liquid state, allows for a temperature-resistant connection. Another patent details an optical waveguide plug adhesive that consists of two components. One component can be stored anaerobically for an extended period, while the second component initiates polymerization upon contact with the first. This innovative approach ensures stable storage and effective bonding during assembly.

Career Highlights

Kurt Stephan is associated with Huber & Suhner AG, a company known for its advancements in connectivity solutions. His work has been instrumental in developing reliable methods for optical fiber connections, which are crucial in telecommunications and data transmission.

Collaborations

Kurt has collaborated with notable coworkers, including Daniel Greub and Beat Koch. Their combined expertise has contributed to the successful development of innovative solutions in the optical fiber domain.

Conclusion

Kurt Stephan's contributions to optical fiber technology through his patents and work at Huber & Suhner AG highlight his role as a key innovator in the field. His advancements continue to influence the industry and improve connectivity solutions.

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