US

Kurt S Meyers

This inventor holds 0 USPTO granted patents, plus 1 CIPO patent.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kurt S Meyers. Retrieved from https://idiyas.com/inventor/kurt-s-meyers

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0

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Title: Kurt S. Meyers: Innovator in Down Hole Fusing Technology

Introduction

Kurt S. Meyers is an inventive mind based in the United States, known for his contributions to the field of down hole fusing technology. He has developed a unique apparatus and method aimed at improving service connections to polyolefin pipes. His innovative approach addresses the challenges faced in underground pipe fusing, making it a significant advancement in the industry.

Latest Patents

Kurt S. Meyers currently holds no patents. However, his notable invention is titled "Apparatus And Method For Down Hole Fusing." This invention focuses on an apparatus that facilitates service connections to polyolefin pipes. The design includes a base that seats on the pipe underground, rods extending to the surface, and a heating element that is hinged to the base. The method involves several steps, including locating the service, excavating an opening, and fusing a stack to the polyethylene pipe.

Career Highlights

Kurt S. Meyers is associated with Tti Trenchless Technologies, Inc., where he applies his expertise in developing innovative solutions for trenchless technology. His work has contributed to enhancing the efficiency and reliability of underground pipe installations.

Collaborations

Kurt collaborates with Cleve C. Reber, a coworker at Tti Trenchless Technologies, Inc. Together, they work on advancing technologies that improve the methods used in the industry.

Conclusion

Kurt S. Meyers is a dedicated inventor whose work in down hole fusing technology showcases his commitment to innovation. His contributions, although not yet patented, reflect a significant understanding of the challenges in the field. His collaboration with industry professionals further enhances the potential for future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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