San Jose, CA, United States of America

Kurt E Sincerbox

USPTO Granted Patents = 1 

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2014

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1 patent (USPTO):Explore Patents

Title: Kurt E Sincerbox: Innovator in Chip Carrier Technology

Introduction

Kurt E Sincerbox is a notable inventor based in San Jose, CA (US). He has made significant contributions to the field of electronic packaging through his innovative designs and methods. With a focus on enhancing the functionality and efficiency of chip carriers, Sincerbox has secured a patent that showcases his expertise.

Latest Patents

Kurt E Sincerbox holds a patent for a "Universal chip carrier and method." This invention describes a method of fabricating chip carriers suitable for use in packaging integrated circuits and other electronic, electro-mechanical, and opto-electronic devices. The process involves arranging a number of wires (or wires and rods) in parallel within a wiring fixture. Once positioned, the wires are encapsulated to form an encapsulated wiring block, which is then sliced into discrete panels. Each panel is geometrically designed to define multiple device areas, with the encapsulant forming a substrate and the wire segments acting as conductive vias. This innovative approach allows for a wide variety of packaging applications.

Career Highlights

Kurt E Sincerbox has had a distinguished career, primarily working with National Semiconductor Corporation. His work has focused on advancing technologies that improve the packaging of electronic devices. His patent reflects his commitment to innovation and excellence in the field.

Collaborations

Throughout his career, Sincerbox has collaborated with talented individuals such as Artur Darbinyan and David Chin. These collaborations have contributed to the development of cutting-edge technologies in the semiconductor industry.

Conclusion

Kurt E Sincerbox is a prominent figure in the realm of chip carrier technology, with a patent that highlights his innovative approach to electronic packaging. His contributions continue to influence the industry and pave the way for future advancements.

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