Company Filing History:
Years Active: 1992
Title: Kurt C Conrath: Innovator in Semiconductor Packaging
Introduction
Kurt C Conrath is a notable inventor based in Lauderhill, Florida. He has made significant contributions to the field of semiconductor packaging, particularly through his innovative designs that enhance the functionality and reliability of electronic devices.
Latest Patents
One of his key patents is for an overmolded semiconductor package with anchoring means. This invention involves the formation of an overmolded semiconductor package by electrically and mechanically attaching a semiconductor device to a substrate that has at least one hole. A plastic molding compound is overmolded around the semiconductor device to encapsulate it, with the molding compound extending into the substrate hole to form an anchor. This design not only aids in bonding the molding compound to the substrate but also allows for additional functionalities such as forming a pedestal or alignment pin.
Career Highlights
Kurt C Conrath has worked with Motorola Corporation, where he has been able to apply his innovative ideas in a practical setting. His work has contributed to advancements in semiconductor technology, making devices more efficient and reliable.
Collaborations
Throughout his career, Kurt has collaborated with notable colleagues such as Nicolaas H Worp and Bruce J Freyman. These collaborations have likely fostered an environment of innovation and creativity, leading to the development of cutting-edge technologies.
Conclusion
Kurt C Conrath's contributions to semiconductor packaging demonstrate his commitment to innovation in the electronics industry. His patent for the overmolded semiconductor package showcases his ability to solve complex engineering challenges.