Motorola Corporation

Kurt C Conrath

Bruce J Freyman

Nicolaas H Worp

An overmolded semiconductor package (150) is formed by electrically and mechanically attaching a semiconductor device (100) to a substrate (110) having at least one hole (130). A plastic molding compound (140) is overmolded around the semiconductor device 100) so as to encapsulate the device, the molding compound (140) extending at least partially into the substrate hole (130) to form an anchor (135) to aid in bonding the molding compound to the substrate. An alternate embodiment of the invention forms a pedestal (449) from the portion of the molding compound extending beyond the surface of the substrate. The pedestal functions as an anchor to aid in bonding the molding compound (440) to the substrate, and also as a spacer to maintain a preselected clearance between the substrate (410) and the printed circuit board (460). The portion of the molding compound extending beyond the surface of the substrate may also be used to form an alignment pin (548). The pin functions as an anchor to aid in bonding the molding compound to the substrate, and also as an alignment aid to maintain positional relationships between the substrate and the printed circuit board. In another embodiment of the invention, the overmolded semiconductor is mounted directly on a printed circuit board containing other active circuitry.

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Lauderhill, FL, United States of America

Kurt C Conrath