Neyagawa, Japan

Kurayasu Hamasaki



Average Co-Inventor Count = 5.5

ph-index = 6

Forward Citations = 108(Granted Patents)


Location History:

  • Moriguchi, JP (1995 - 1998)
  • Osaka-fu, JP (2006)
  • Katano, JP (1999 - 2007)
  • Neyagawa, JP (2005 - 2011)

Company Filing History:


Years Active: 1995-2011

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14 patents (USPTO):Explore Patents

Title: Kurayasu Hamasaki: Innovator in Component Mounting Technology

Introduction

Kurayasu Hamasaki is a notable inventor based in Neyagawa, Japan. He has made significant contributions to the field of component mounting technology, holding a total of 14 patents. His innovative designs have advanced the efficiency and effectiveness of mounting components on various boards.

Latest Patents

Hamasaki's latest patents include a component mounting apparatus designed for mounting multiple components on a board. This apparatus features a board holding device that secures the board at a designated position. It includes a first mounting head that retrieves components from a first feeding position and mounts them onto the board. Additionally, a second mounting head operates similarly with components from a second feeding position. The apparatus is equipped with a component feeding device that utilizes a wafer holding table, allowing for the reciprocation of the table between the two feeding positions.

Another significant patent is for an apparatus and method for removing semiconductor chips. This method involves sucking and holding a pressure-sensitive adhesive sheet in the vicinity of the semiconductor chip's adhesion region. Protruding portions of a removing member contact the chip's bottom surface through the adhesive sheet, allowing for a change in the adhesive bond to point bonding. This innovative approach reduces the adhesive bonding force, facilitating the removal of the semiconductor chip from the adhesive sheet.

Career Highlights

Throughout his career, Kurayasu Hamasaki has worked with prominent companies such as Matsushita Electric Industrial Co., Ltd. and Panasonic Corporation. His experience in these organizations has contributed to his expertise in the field of electronics and component mounting technologies.

Collaborations

Hamasaki has collaborated with notable coworkers, including Kazumi Ishimoto and Kimihito Kuwabara. Their collective efforts have furthered advancements in the technologies they have worked on together.

Conclusion

Kurayasu Hamasaki's contributions to component mounting technology and semiconductor chip removal have established him as a significant figure in the field. His innovative patents and collaborations reflect his dedication to advancing technology in electronics.

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