Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Kurayasu Hamasaki

Kazumi Ishimoto

Masahiro Taniguchi

Kunio Sakurai

Kimihito Kuwabara

Akira Kabeshita

Shozo Minamitani

Toshinori Mimura

Youichi Nakamura

Kenichi Nakano

Muneyoshi Fujiwara

Yoichi Makino

Noriyuki Tani

Manabu Ando

Minoru Yamamoto

Makito Seno

Ken Takano

Yoshiyuki Nagai

Hiroshi Ota

Seiichi Mogi

Akiko Katsui

Ken Takahashi

Toshiaki Yamauchi

Takao Naito

Nobuya Matsumura

Kazue Okanoue

Akiko Ida

Hirotsugu Uemori

Yoichi Nakamura

Koji Mitsushiro

A component mounting apparatus for mounting a plurality of components on a board. The apparatus is provided with a board holding device for holding the board at a board holding position, a first mounting head for holding and taking out a component fed from a first component feeding position and mounting the component on the board held at the board holding position, a second mounting head for holding and taking out the component fed from a second component feeding position and mounting the component on the held board, and a component feeding device having a wafer holding table for holding a wafer on which the respective components are fed so that the wafer holding table can be moved reciprocationally between the first component feeding position and the second component feeding position.

Component mounting apparatus

While a vicinity of a bottom surface-side region of a pressure-sensitive adhesive sheet, corresponding to an adhesion region of a semiconductor chip, is sucked and held, a plurality of protruding portions of a removing member are brought into contact with the bottom surface of the semiconductor chip through the adhesive sheet at the adhesion region. Also, the adhesive sheet is sucked in between the respective protruding portions so as to change an adhesive surface bond of the semiconductor chip to the adhesive sheet to point bonding. Further, the removing member is moved along the bottom surface of the semiconductor chip so as to change the position of the point bonding and decrease the adhesive bonding force to the adhesive sheet. Then, the semiconductor chip is removed from the adhesive sheet.

Apparatus and method for removing semiconductor chip

A component mounting apparatus and method for mounting a plurality of components on a board. The aparatus is provided with a board holding device for holding the board at a board holding position, a first mounting head for holding and taking out a component fed from a first component feeding position and mounting the component on the board held at the board holding position, a second mounting head for holding and taking out the component fed from a second component feeding position and mounting the component on the held board, and a component feeding device having a wafer holding table for holding a wafer on which the respective components are fed so that the wafer holding table can be moved reciprocationally between the first component feeding position and the second component feeding position.

Component mounting method

Apparatus for mounting components, even if the components have narrow inter-component distances, without producing any interference between already mounted components and suction nozzles or components being suction-held by the suction nozzles. The component mounting apparatus for picking up electronic components supplied from a component supply section by suction nozzles attached to a mounting head and mounting electronic components on a printed circuit board, includes a control section containing information relating to components to be mounted and controlling, based on this information, the positions of the suction nozzle, the mounting head and the printed circuit board so that components to be mounted are mounted in ascending order of height.

Apparatus for mounting component

The present invention has for its object to provide an apparatus and a method for transferring boards, and a component mounting apparatus whereby a production efficiency can be improved in accordance with types of boards to be produced. For accomplishing this object, there are arranged a shift device capable of moving a mounted board from a process-finished board transfer path to an unprocessed board transfer path, a controller for controlling this moving, and an identifying device. This arrangement enables switching of a method of transferring boards in accordance with types of boards to be produced, and controlling supply of boards to the component mounting apparatus, so that production efficiency is improved in accordance with types of boards.

Board transferring apparatus including identifying devices, and component mounting apparatus including the board transferring apparatus

The present invention has for its object to provide a mechanism for preventing a liquid from splashing from a liquid tank, and a component mounting apparatus with this liquid splashing prevention mechanism. The liquid splash prevention mechanism has a first seal member with a circumferential outer face attached to a first driving lever in a lubricating oil tank, and a second seal member with an arc face set in the lubricating oil tank correspondingly to the first seal member so that a sealing gap for preventing lubricating oil from scattering is formed between the first seal member and the second seal member. Moreover, the lubricating oil is filled in the sealing gap. Scattering of the lubricating oil is more surely prevented by this arrangement. Quality degradation to be caused by adhesion of the lubricating oil to printed boards and the like can be prevented, and productivity can be improved.

Liquid splash preventing mechanism and component mounting apparatus

Board transfer apparatus, board transfer method, and component mounting apparatus

Apparatus for mounting components, even if the components have narrow inter-component distances, without producing any interference between already mounted components and suction nozzles or components being suction-hold by the suction nozzles. The component mounting apparatus for picking up electronic components supplied from a component supply section by suction nozzles attached to a mounting head and mounting electronic components on a printed circuit board, includes a control section containing information relating to components to be mounted and controlling, based on this information, the positions of the suction nozzle, the mounting head and the printed circuit board so that components to be mounted are mounted in ascending order of height.

Apparatus for mounting components

Each of a plurality of suction nozzle sections provided about the outer circumference of an intermittently rotating head section comprises a plurality of nozzle tip sections for picking up electronic components by suction, these nozzle tip sections being connected to a rod section , which is driven to rotate by a motor . A cylindrical cam section having a cam surface and being able to rotate relative to the rod section is provided such as to encase the nozzle tip sections , and one ends of the nozzle tip sections engage with the cam surface 8a of the cam section via rollers , whereby the nozzle tip sections are movable in a vertical direction. On the outer side of the cylindrical cam section , a stopper section is provided for halting temporarily the rotation of only the cylindrical cam surface

Electronic component mounting apparatus

A main wiping portion which contacts the back of a mask through a cleaning paper is provided behind a suction port as viewed in the direction of movement of an air suction portion. The cleaning paper is able to wipe off both solder paste adhered on the back of the mask and solder paste discharged from openings of the mask by suction through the suction port, whereby the solder paste deposits on the mask can be cleaned off at high removal efficiency.

Printing mask cleaning apparatus and method

The present invention provides a reflow apparatus and method effective to make constant the internal gas flow direction in a heating section within a reflow furnace. A circulating gas path is formed in a heating unit which collects and causes the gas to flow from a sirocco fan, up the rear side of the heating unit and then down towards a circuit board moving along a transfer path at the front side of the heating unit. Moreover, a plurality of straightening plates are arranged above the transfer path of the heating unit so as to guide the hot gas, which is flowing forwardly downwardly toward the circuit board moving along the transfer path. A blow-down nozzle is provided and includes a plurality of plates aligned in rows in the transferring direction of the circuit boards. The plates have an inverse U-shaped cross section. The blow-down nozzle is arranged below the straightening plates to cause the vertical hot gas flows to flow uniformly over the whole surface of the circuit board.

Reflow apparatus and method

A reflow apparatus includes a reflow furnace. A transfer device holds and transfers printed circuit boards with to-be-reflowed electronic components thereon from an inlet to an outlet of the furnace within the furnace. A plurality of adjusting/circulating sections separate an ambient gas for heating the printed circuit boards into predetermined temperature regions in the furnace in which the ambient gas is circulated in a heated state. A feed port is formed in the furnace to feed the ambient gas into the furnace under pressure. Residence parts each provided between adjacent adjusting/circulating sections regulate the amount of the ambient gas when the ambient gas, after having been sent to and heated in the adjusting/circulating section adjacent to the feed port, is circulated and sequentially moved to the adjusting/circulating sections at the inlet or the outlet and finally flows out through the inlet or outlet into atmosphere. Suction ports are open to the furnace to suck the ambient gas from the inside of the furnace. A flux removing unit is separate from the furnace and removes components of a flux from the ambient gas sucked through the suction ports from the inside of the furnace.

Reflow apparatus

Growing community of inventors

Neyagawa, Japan

Kurayasu Hamasaki