This inventor holds 1 USPTO granted patent. Top assignee: United Test Center Inc.. Active years: 2001.
Company Filing History:
Years Active: 2001
Title: Kuo-Teh Ho: Innovator in Chip Scale Packaging
Introduction
Kuo-Teh Ho is a prominent inventor based in Taipei, Taiwan. He is known for his innovative contributions to the field of semiconductor packaging. With a focus on enhancing the efficiency and effectiveness of chip packaging methods, Ho has made significant strides in this area.
Latest Patents
Kuo-Teh Ho holds a patent for a chip scale packaging method. This method involves packaging a single-sided substrate along with one or more semiconductor chips. The nonconductive surface of the substrate is designed with chip-implanting adhesive areas, which are created through stenciling. These adhesive areas feature through holes that align with the bonding pads of the chips. After implanting the chips, the substrate and chips are heated under pressure, allowing for the bonding pads to connect with the conductive surface of the substrate using metal bonding wires. The process concludes with the application of a passivation layer and the implantation of spherical bonding points in a grid array fashion.
Career Highlights
Kuo-Teh Ho is associated with United Test Center Inc., where he continues to develop and refine his innovative packaging techniques. His work has contributed to advancements in semiconductor technology, making it more efficient and reliable.
Collaborations
Throughout his career, Kuo-Teh Ho has collaborated with notable colleagues, including Cheng-Hui Lee and Chong-Ren Maa. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
Kuo-Teh Ho's contributions to chip scale packaging represent a significant advancement in semiconductor technology. His innovative methods and collaborative spirit continue to influence the industry positively.