Company Filing History:
Years Active: 2019
Title: Kuo-Lung Li: Innovator in Package Structures
Introduction
Kuo-Lung Li is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of semiconductor packaging, particularly through his innovative patent.
Latest Patents
Kuo-Lung Li holds a patent titled "Method for forming package structure including intermetallic compound." This patent describes a package structure that includes a package component with a first bump and an intermetallic compound (IMC) on that bump. The structure also features an integrated circuit die with a second bump on the IMC. The bonding between the integrated circuit die and the package component is achieved through the first and second bumps. The IMC extends from the first bump to the second bump, ensuring robust physical and electrical connections.
Career Highlights
Kuo-Lung Li is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work focuses on enhancing package structures, which are crucial for the performance and reliability of electronic devices.
Collaborations
Throughout his career, Kuo-Lung Li has collaborated with talented individuals such as Heng-Chi Huang and Chien-Chen Li. These collaborations have contributed to advancements in semiconductor technology.
Conclusion
Kuo-Lung Li's innovative work in package structures and his patent on intermetallic compounds highlight his significant role in the semiconductor industry. His contributions continue to influence the development of reliable electronic devices.