Kuo-Fu Peng

Title: Kuo-Fu Peng: Innovator in Semiconductor Packaging

Introduction

Kuo-Fu Peng is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of semiconductor packaging. His innovative designs have paved the way for advancements in electronic devices.

Latest Patents

Kuo-Fu Peng holds a patent for a semiconductor package that includes at least four lead frames, each having an extending portion and a connecting portion. The design features a heat dissipation plate with a top surface and a bottom surface, along with at least one semiconductor chip positioned on the top surface of the heat dissipation plate. Additionally, at least one conductive wire electrically connects the chip to the lead frames. The entire assembly is encapsulated, covering the lead frames, heat dissipation plate, semiconductor chip, and conductive wires, while ensuring that the bottom surface of the heat dissipation plate and the extending portions of the lead frames remain exposed. This innovative design enhances the efficiency and performance of semiconductor devices. Kuo-Fu Peng has 1 patent to his name.

Career Highlights

Kuo-Fu Peng is currently employed at Advanced Optoelectronic Technology, Inc., where he continues to develop cutting-edge technologies in the semiconductor industry. His work has been instrumental in advancing the capabilities of semiconductor packaging, which is crucial for modern electronic applications.

Collaborations

Throughout his career, Kuo-Fu Peng has collaborated with talented individuals in the field, including Chien-Min Chen and Ko-Wei Chien. These collaborations have fostered innovation and have contributed to the success of various projects within the semiconductor sector.

Conclusion

Kuo-Fu Peng is a distinguished inventor whose work in semiconductor packaging has made a significant impact on the industry. His innovative designs and collaborations continue to drive advancements in technology, showcasing his dedication to improving electronic devices.