Taipei, Taiwan

Kuo-Feng Lo


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2016

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1 patent (USPTO):Explore Patents

Title: Kuo-Feng Lo: Innovator in Semiconductor Technology

Introduction

Kuo-Feng Lo is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in methods that enhance the manufacturing process of integrated circuits. His innovative approach has led to the development of a unique patent that addresses common challenges in the industry.

Latest Patents

Kuo-Feng Lo holds a patent titled "Method of controlling contact hole profile for metal fill-in." This patent describes a method for eliminating overhang in a contact hole formed in a contact film stack. The process involves overlaying a liner layer on the contact film stack, which also coats the contact hole. A portion of the liner is then removed to expose the overhang, which is subsequently eliminated. The liner is also utilized to fill in a bowing profile of the contact hole, resulting in smooth and straight sidewalls that are suitable for metal fill-in while suppressing piping defects. This innovation is crucial for improving the reliability and performance of semiconductor devices.

Career Highlights

Kuo-Feng Lo is currently employed at Macronix International Co., Ltd., a leading company in the semiconductor industry. His work at Macronix has allowed him to apply his expertise in semiconductor manufacturing processes and contribute to the advancement of technology in this field.

Collaborations

Kuo-Feng Lo has collaborated with notable colleagues, including Fang-Hao Hsu and Hsu-Sheng Yu. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas, further enhancing the development of new technologies.

Conclusion

Kuo-Feng Lo's contributions to semiconductor technology through his innovative patent demonstrate his commitment to advancing the industry. His work not only addresses existing challenges but also paves the way for future developments in semiconductor manufacturing.

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