Company Filing History:
Years Active: 2005
Title: Kuo-Chung Chan: Innovator in Photolithographic Precision Alignment
Introduction
Kuo-Chung Chan is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of photolithography, particularly in the area of wafer bonding processes. His innovative methods have the potential to enhance the precision and efficiency of semiconductor manufacturing.
Latest Patents
Kuo-Chung Chan holds a patent for a method of maintaining photolithographic precision alignment after the wafer bonding process. This method involves creating two cavities at the rear surface of a top wafer, corresponding to alignment marks on a bottom wafer. The depth of these cavities is designed to be deeper than that of the final membrane structure. After bonding the top wafer to the bottom wafer, which already contains alignment marks and a microstructure, the bonded wafer undergoes an annealing process to strengthen the bond. Subsequently, a thinning process is applied until the top wafer is reduced to a thickness thinner than the cavity depth, allowing the alignment marks to emerge in the top wafer cavities. This innovation serves as alignment marks for exposure equipment, significantly improving the accuracy of the photolithographic process.
Career Highlights
Kuo-Chung Chan is currently employed at Asia Pacific Microsystems, Inc., where he continues to develop and refine his innovative techniques. His work has been instrumental in advancing the capabilities of semiconductor technology.
Collaborations
Kuo-Chung Chan has collaborated with several talented individuals in his field, including Chung-Yang Tseng and Shih-Chin Gong. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies.
Conclusion
Kuo-Chung Chan's contributions to the field of photolithography exemplify the importance of innovation in semiconductor manufacturing. His patented method for maintaining photolithographic precision alignment after wafer bonding is a testament to his expertise and dedication to advancing technology.