Maplewood, MN, United States of America

Kunwei Liu


 

Average Co-Inventor Count = 7.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Kunwei Liu: Innovator in Resin Technology

Introduction

Kunwei Liu is a notable inventor based in Maplewood, MN (US). He has made significant contributions to the field of resin technology, particularly with his innovative patent that enhances adhesion properties in polyester applications. His work reflects a commitment to advancing materials science and engineering.

Latest Patents

Kunwei Liu holds a patent for a resin that includes a catalyst for reactive adhesion to polyester. This resin comprises up to 99.99 weight percent (wt. %) of a first polyolefin grafted with a functional group selected from ethylenically unsaturated carboxylic acids, carboxylic acid anhydrides, ester functional groups, or combinations thereof. Additionally, it contains 0.01 to 3.0 wt. % of a tin oxide-based catalyst. The resin is designed for use in multilayer structures, where it adheres effectively to polyester layers, showcasing its practical applications in various industries.

Career Highlights

Throughout his career, Kunwei Liu has worked with prominent organizations, including Dow Global Technologies LLC and the University of Minnesota. His experience in these institutions has allowed him to develop and refine his innovative ideas, contributing to advancements in resin technology.

Collaborations

Kunwei Liu has collaborated with notable colleagues such as Alex Michael Jordan and Christopher John Ellison. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Kunwei Liu's contributions to resin technology exemplify the impact of innovation in material science. His patent for a resin with enhanced adhesion properties demonstrates his dedication to improving industrial applications. His work continues to inspire future advancements in the field.

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