Osaka, Japan

Kunio Sakurai

This inventor holds 1 USPTO granted patent. Top assignee: Panasonic Corporation. Active years: 2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kunio Sakurai. Retrieved from https://idiyas.com/inventor/kunio-sakurai-wu6y6e3a

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 8.0

ph-index = 1

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 2010

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1 patent (USPTO):Explore Patents

Title: Kunio Sakurai: Innovator in Substrate Connecting Technology

Introduction

Kunio Sakurai is a notable inventor based in Osaka, Japan. He is recognized for his contributions to the field of electronic components, particularly in the development of substrate connecting members. His innovative work has led to advancements that enhance the reliability of electronic connections.

Latest Patents

Sakurai holds a patent for a substrate connecting member and connecting structure. This invention addresses the challenge of maintaining high reliability at junctions between circuit boards, even when they are subjected to temperature changes or impact loads. The substrate connecting member features a frame made of insulating resin, with slit grooves formed in the frame's side portions. These grooves extend throughout the length of the frame, and the design includes connection conductor portions with terminals on both the top and bottom surfaces.

Career Highlights

Kunio Sakurai is associated with Panasonic Corporation, a leading company in the electronics industry. His work at Panasonic has allowed him to focus on innovative solutions that improve electronic device performance and durability.

Collaborations

Sakurai has collaborated with notable colleagues, including Masato Mori and Yoshihiko Yagi. Their combined expertise has contributed to the successful development of advanced electronic components.

Conclusion

Kunio Sakurai's innovative contributions to substrate connecting technology exemplify the importance of reliability in electronic design. His patent reflects a significant advancement in the field, showcasing his commitment to enhancing electronic connections.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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