Shiga, Japan

Kunio Kondo

This inventor holds 1 USPTO granted patent. Top assignee: Gunze Kabushiki Kaisha. Active years: 1989.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kunio Kondo. Retrieved from https://idiyas.com/inventor/kunio-kondo-j17oy237

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 1989

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1 patent (USPTO):Explore Patents

Title: Kunio Kondo: Innovator in Film Laminates

Introduction

Kunio Kondo is a notable inventor based in Shiga, Japan. He has made significant contributions to the field of materials science, particularly in the development of film laminates. His innovative work has led to the creation of a patented process that enhances the quality and durability of printed materials.

Latest Patents

Kunio Kondo holds a patent for a "Film for print laminates and thermocompression bonding process therefor." This invention is crucial for improving the bonding processes used in various applications, ensuring better performance and longevity of printed products. He has 1 patent to his name, showcasing his expertise in this specialized area.

Career Highlights

Kondo is associated with Gunze Kabushiki Kaisha, a company known for its advancements in materials technology. His role at Gunze has allowed him to focus on innovative solutions that meet the demands of modern printing and laminating processes. His work has been instrumental in pushing the boundaries of what is possible in this field.

Collaborations

Throughout his career, Kunio Kondo has collaborated with talented individuals such as Takeshi Yamamoto and Hiroshi Yoshimura. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Kunio Kondo's contributions to the field of film laminates and thermocompression bonding processes highlight his role as a key innovator in materials science. His work continues to influence the industry and pave the way for future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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