Company Filing History:
Years Active: 2019-2020
Title: Innovations of Kunhan Hsieh in Photosensitive Polyimide Resin Technology
Introduction
Kunhan Hsieh is a notable inventor based in Tainan, Taiwan. He has made significant contributions to the field of materials science, particularly in the development of photosensitive polyimide resin compositions. With a total of two patents to his name, Hsieh's work is recognized for its innovative approach to manufacturing cover films.
Latest Patents
Hsieh's latest patents focus on a photosensitive polyimide resin composition and the method of manufacturing cover films using this composition. The resin composition includes an infrared absorber, an epoxy, a photosensitive polyimide, and a photo initiator. The infrared absorber, which contains pigment, constitutes 5-40% of the total solid weight of the composition. Similarly, the epoxy also accounts for 5-40% of the total solid weight. The photosensitive polyimide has a specific structure defined in his patent documentation.
Career Highlights
Kunhan Hsieh is associated with Microcosm Technology Co., Ltd., where he applies his expertise in polymer chemistry and materials engineering. His work has led to advancements in the production of high-performance materials that are essential in various technological applications.
Collaborations
Hsieh collaborates with Tang-Chieh Huang, contributing to the innovative projects at Microcosm Technology Co., Ltd. Their combined efforts enhance the research and development capabilities of the company.
Conclusion
Kunhan Hsieh's contributions to the field of photosensitive polyimide resin technology demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of material properties and their applications in modern technology.