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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10584209 B1

PDFFull Text
Date of Patent:
Mar. 10, 2020

Filed:

Jul. 23, 2019

Photosensitive polyimide resin composition and method of manufacturing cover film using the same

Applicant:

Microcosm Technology Co. Ltd, Tainan, TW;

Inventors:

Tang-Chieh Huang, Tainan, TW;

Kunhan Hsieh, Tainan, TW;

Assignee:

Microcosm Technology Co., Ltd., Tainan, TW;

Attorney:

Haverstock & Owens LLP

Primary Examiner:

Ana L Woodward

Int. Cl.
CPC ...
C08G 73/10 (2006.01); C08G 59/02 (2006.01); C08L 79/08 (2006.01); C09B 57/10 (2006.01); C09B 69/10 (2006.01); G03F 7/038 (2006.01); G03F 7/16 (2006.01); G03F 7/40 (2006.01); G03F 7/075 (2006.01);
U.S. Cl.
CPC ...
C08G 73/1042 (2013.01); C08G 59/02 (2013.01); C08G 73/106 (2013.01); C08G 73/1046 (2013.01); C08L 79/08 (2013.01); C09B 57/10 (2013.01); C09B 69/10 (2013.01); G03F 7/0384 (2013.01); G03F 7/0387 (2013.01); G03F 7/0757 (2013.01); G03F 7/168 (2013.01); G03F 7/40 (2013.01); C08L 2666/70 (2013.01);
Abstract

A photosensitive polyimide resin composition is provided. The resin composition comprises an infrared absorber, an epoxy, a photosensitive polyimide and a photo initiator. The infrared absorber includes pigment and has an amount of weight accounting for 5-40% of total solid weight of the photosensitive polyimide resin composition. The epoxy has an amount of weight accounting for 5-40% of total solid weight of the photosensitive polyimide resin composition. The photosensitive polyimide has the structure of formula (1):

Find Patent Forward Citations

Huang, Tang-Chieh. (2020). Photosensitive polyimide resin composition and method of manufacturing cover film using the same (U.S. Patent No. 10584209). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10584209

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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