Wappingers Falls, NY, United States of America

Kung Y Lee

This inventor holds 1 USPTO granted patent. Top assignee: Texaco Inc.. Active years: 1986.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kung Y Lee. Retrieved from https://idiyas.com/inventor/kung-y-lee

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 1986

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1 patent (USPTO):Explore Patents

Title: Innovations of Kung Y Lee

Introduction

Kung Y Lee is an accomplished inventor based in Wappingers Falls, NY. He has made significant contributions to the field of materials science, particularly in the development of methods for coating substrates.

Latest Patents

Kung Y Lee holds a patent for a method of forming an alumina coated substrate. This innovative method involves contacting a substrate with a supersaturated aqueous alkali aluminate solution. The solution has an alkali metal hydroxide concentration ranging from 0.75 to 1.5 molar and an aluminum to alkali mole ratio ranging from 0.65 to 0.70.

Career Highlights

Kung Y Lee is currently employed at Texaco Inc., where he applies his expertise in materials science. His work has contributed to advancements in various applications, enhancing the performance and durability of coated substrates.

Collaborations

Kung Y Lee collaborates with Matthew A McMahon, leveraging their combined knowledge and skills to drive innovation in their projects.

Conclusion

Kung Y Lee's contributions to the field of materials science through his patent and work at Texaco Inc. highlight his role as a significant inventor in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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