This inventor holds 1 USPTO granted patent. Top assignee: Ama Precision Inc.. Active years: 2009.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2009
Title: Innovations by Kung-Jen Yan
Introduction
Kung-Jen Yan is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of heat-dissipation technology. His innovative designs aim to improve the efficiency and effectiveness of electronic devices.
Latest Patents
Kung-Jen Yan holds a patent for a "Clip module and heat-dissipation device having the same." This invention includes a retention module disposed on a circuit board with a heat source, a heat sink, and a clip module. The clip module is designed to secure the heat sink onto the heat source, ensuring optimal heat dissipation. The design features a body, a fastener, and a pressing structure that work together to enhance the performance of electronic components.
Career Highlights
Kung-Jen Yan is currently associated with Ama Precision Inc., where he continues to develop innovative solutions in the field of electronics. His work focuses on creating efficient thermal management systems that are crucial for modern electronic devices.
Conclusion
Kung-Jen Yan's contributions to heat-dissipation technology exemplify the importance of innovation in enhancing electronic device performance. His patent reflects a commitment to improving efficiency in the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile