Jiangsu, China

Kun Wu

This inventor holds 1 USPTO granted patent. Top assignee: Jiangsu University. Active years: 2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kun Wu. Retrieved from https://idiyas.com/inventor/kun-wu-r4s0uf1z

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 10.0

ph-index = 1


Company Filing History:


Years Active: 2020

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Kun Wu - Innovator in Laser-Inducing Cavitation Strengthening

Introduction

Kun Wu is a prominent inventor based in Jiangsu, China. He has made significant contributions to the field of laser technology, particularly in the area of cavitation strengthening. His innovative approach combines multiple systems to enhance the effectiveness of laser applications.

Latest Patents

Kun Wu holds a patent for a "Device for laser-inducing cavitation strengthening with multi-system automatic coordination work." This device includes several systems, such as a clamping system, a lifting system, an imaging system, a computer control system, a laser system, and an energy density amplifying system. The invention aims to improve the process of laser-induced cavitation strengthening, making it more efficient and effective.

Career Highlights

Kun Wu is affiliated with Jiangsu University, where he continues to advance his research and development in laser technology. His work has garnered attention for its innovative approach and practical applications in various industries.

Collaborations

Kun Wu has collaborated with notable colleagues, including Yanqun Tong and Deshun Wang. Their combined expertise contributes to the advancement of their research projects and innovations.

Conclusion

Kun Wu's contributions to laser technology and his innovative patent demonstrate his commitment to advancing the field of cavitation strengthening. His work at Jiangsu University continues to inspire future innovations in this area.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…