Xi'An, China

Kun Wang

This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Samsung Electronics Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kun Wang. Retrieved from https://idiyas.com/inventor/kun-wang-35c871rc

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Kun Wang and Wireless Earphone Innovation.

Introduction

Kun Wang is an inventor based in Xi’an, China, and is associated with Samsung Electronics. His listed patent concerns wireless earphones and methods for controlling them.

Latest Patents

Wang is credited with 1 patent, titled “Wireless Earphones and Control Method Thereof, Computer Equipment and Storage Medium.” The invention describes establishing a Bluetooth connection between a source device and one earphone. When the source supports Ultra Wide Band (UWB), the method also establishes separate UWB connections between the source and each earphone. Each earphone can then receive audio data from the source through its respective UWB connection.

Career Highlights

The available information identifies Wang’s work on wireless audio technology and his association with Samsung Electronics. The patent combines Bluetooth and UWB connectivity in a method for delivering audio to a pair of wireless earphones.

Collaborations

Wang’s listed coworkers include Yajun Zhi and Dong Xu. They are also associated with the patent information provided.

Conclusion

Kun Wang’s patent describes a wireless earphone control approach that uses Bluetooth and, when supported, separate UWB connections to deliver audio to both earphones.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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