Beijing, China

Kun Shi

This inventor holds 34 USPTO granted patents and 4 published patent applications and 1 EPO patent, primarily in Virtual Desktop Infrastructure. Top assignees: Vmware, Inc., Omnissa, LLC, Alcatel-Lucent USA Inc.. Active years: 2011-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kun Shi. Retrieved from https://idiyas.com/inventor/kun-shi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 34 

% Patents Active = 97.1

 

Average Co-Inventor Count = 4.8

ph-index = 3

Forward Citations = 108(Granted Patents)


Company Filing History:


Years Active: 2011-2026

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Areas of Expertise:
Virtual Desktop
Secure Printing
Remote Computing
Clipboard Redirection
Input/Output Performance
Document Watermarking
Cache Management
Economic Printing
Cross-Device Setup
Access Control
Image Scanning
File Sharing
34 patents (USPTO):Explore Patents

Title: Inventor Kun Shi - Revolutionizing Technology in Beijing

Introduction: Kun Shi is a visionary inventor based in Beijing, China, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Kun Shi holds several patents in the areas of artificial intelligence, robotics, and renewable energy technologies, showcasing his commitment to pushing the boundaries of technological advancement.

Career Highlights: With a career spanning over two decades, Kun Shi has worked with leading tech companies and research institutions, spearheading projects that have led to significant advancements in various industries.

Collaborations: Kun Shi has collaborated with top engineers, scientists, and researchers from around the world, fostering a culture of innovation and knowledge-sharing to drive progress in the tech sector.

Conclusion: Kun Shi's relentless pursuit of innovation and his passion for creating technology that makes a difference have solidified his reputation as a pioneering inventor in Beijing and beyond.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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