Kun Ran

Title: The Innovative Contributions of Kun Ran

Introduction

Kun Ran is a notable inventor based in Dongguan, China. He has made significant strides in the field of technology, particularly in the development of advanced electronic components. His work has led to the creation of a unique patent that enhances the functionality of mobile devices.

Latest Patents

Kun Ran holds a patent for a photosensitive chip package structure, which is integral to camera modules and mobile terminals. This innovative design includes a substrate with a photosensitive chip mounted on it. The chip features a photosensitive area surrounded by a non-photosensitive area, allowing for improved performance. The structure also incorporates a frame with an avoidance groove to protect the metal wire connections, ensuring durability and efficiency in mobile applications.

Career Highlights

Throughout his career, Kun Ran has been associated with Honor Device Co., Ltd., a company known for its cutting-edge technology in mobile devices. His contributions have played a crucial role in advancing the company's product offerings and enhancing user experience.

Collaborations

Kun Ran has worked alongside talented colleagues such as Atsushi Yajima and Zhendong Luo. Their collaborative efforts have fostered an environment of innovation and creativity, leading to the successful development of new technologies.

Conclusion

Kun Ran's inventive spirit and dedication to technology have resulted in significant advancements in mobile device components. His patent for the photosensitive chip package structure exemplifies his commitment to innovation in the tech industry.