Huawei Technologies Co., Limited

Honor Device Co., Ltd.

Kun Ran

Lin Yang

Zhenlin Xie

Weichih Lin

Cunying Li

Lifeng Fu

Shusheng Peng

Linghui Zeng

Zhendong Luo

Atsushi Yajima

Zhenkai Qin

Changfu Huang

Xi Cao

Xiangyong Qing

A camera and an electronic device are provided to improve image stabilization. The camera provides an integrated circuit board that includes a fastening assembly and a movable assembly. The movable assembly includes an image sensor carrying assembly, one or more suspended beam assemblies, and one or more flexible assemblies. The image sensor carrying assembly is configured to carry an image sensor. The one or more suspended beam assemblies are configured to fasten a first magnetic driver group or a second magnetic driver group. The one or more suspended beam assemblies and the image sensor carrying assembly are connected to the fastening assembly through the one or more flexible assemblies. The entire circuit board is compact in structure, and the first magnetic driver group or the second magnetic driver group may be directly fastened to the circuit board to drive the image sensor.

Camera and electronic device implementing image stabilization using image sensor displacement

A terminal includes a substrate and a photosensitive chip mounted on the substrate, where a side of the photosensitive chip away from the substrate has a photosensitive area and a non-photosensitive area surrounding the photosensitive area, and the photosensitive chip is electrically connected to the substrate by using a metal wire; and the photosensitive chip package structure further includes: a frame, disposed on the side of the photosensitive chip away from the substrate, where an avoidance groove used to avoid the metal wire is disposed on a side of the frame facing the substrate, the avoidance groove extends along a side edge of the frame, and an inner wall of the avoidance groove is an arc-shaped inner wall; and a filling glue, filled in the avoidance groove, and used to wrap the metal wire and bond the frame to the non-photosensitive area of the photosensitive chip and the substrate.

Photosensitive chip package structure, camera module, and mobile terminal

Growing community of inventors

Dongguan, China

Kun Ran