Shenzhen, China

Kun Mao

This inventor holds 9 USPTO granted patents and 1 published patent application. Top assignees: Shenzhen Leqi Innovation Co., Ltd., Shenzhen Leqi Innovation Co., Ltd.. Active years: 2025-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kun Mao. Retrieved from https://idiyas.com/inventor/kun-mao-shcx8puz

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 9 

% Patents Active = 44.4

Average Co-Inventor Count = 4.4

ph-index = 1

Forward Citations = 8(Granted Patents)


Company Filing History:


Years Active: 2025-2026

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9 patents (USPTO):Explore Patents

Title: Kun Mao: Innovator in Cable Clamp Technology

Introduction

Kun Mao is a prominent inventor based in Shenzhen, China. He has made significant contributions to the field of innovation, particularly with his invention of a cable clamp. His work is recognized for its practicality and efficiency in various applications.

Latest Patents

Kun Mao holds 1 patent for his innovative cable clamp. This invention showcases his ability to address common challenges in cable management, providing a solution that enhances organization and safety.

Career Highlights

Kun Mao is currently employed at Shenzhen Leqi Innovation Co., Ltd. His role at the company allows him to further develop his ideas and contribute to the advancement of technology in his field. His dedication to innovation is evident in his work and the impact it has on the industry.

Collaborations

Kun Mao collaborates with talented individuals such as Yang Zhou and Feng Zhou. Their teamwork fosters a creative environment that encourages the development of new ideas and solutions.

Conclusion

Kun Mao is a noteworthy inventor whose contributions to cable management technology are commendable. His patent for the cable clamp exemplifies his innovative spirit and commitment to improving everyday solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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