Kun Liu

Title: Kun Liu: Inventor of a Hydrogen-Bonded Organic Framework Nanosheet

Introduction

Kun Liu is an inventor associated with Shandong, China. His patent work includes a method for preparing hydrogen-bonded organic framework nanosheets and describes their potential applications.

Latest Patents

The provided patent, “Hydrogen-bonded organic framework nanosheet, preparation method and application thereof,” describes a process for producing nanosheets from 1,2,4,5-tetrakis (4-carboxyphenyl) benzene (HTCPB). The method dissolves HTCPB in N,N-dimethylformamide (DMF) by heating, then places the uncapped container inside a sealed, water-filled outer container and heats it in a constant-temperature oven to form colorless crystals. The resulting solid is filtered, dried, and ground before being dispersed in a solvent. Ultrasonication in an ice-water bath, followed by centrifugation and drying, yields the hydrogen-bonded organic framework nanosheets. The supplied information lists 1 patent for Liu.

Career Highlights

Liu is associated with Yantai University and Qingdao Hisense Hitachi Air-Conditioning Systems Co., Ltd. The available information does not specify his roles or dates of employment at these organizations.

Collaborations

Wei Liu and Xinxin Zhang are identified as Liu’s coworkers. The provided details do not specify their roles in the patent or the nature of their collaboration.

Conclusion

Kun Liu’s listed patent focuses on a preparation route for hydrogen-bonded organic framework nanosheets, combining crystal formation with subsequent processing to obtain the nanosheet material.