Company Filing History:
Years Active: 2023
Title: Kun Liu: Innovator in 3D Measurement Technology
Introduction
Kun Liu is a prominent inventor based in Liaoning, China. He has made significant contributions to the field of 3D measurement technology. His innovative work focuses on enhancing the precision of spatial measurements through advanced calibration methods.
Latest Patents
Kun Liu holds a patent for a "3D measurement model and spatial calibration method based on 1D displacement sensor." This invention proposes a 3D measurement system utilizing a fixed 1D displacement sensor. The patent outlines a spatial measurement model that addresses inaccuracies in spatial measurements caused by sensor extrinsic parameter errors. The method employs weighted iterative algorithms to calculate the extrinsic parameters of the sensor, ensuring high precision in 3D measurements.
Career Highlights
Kun Liu is affiliated with Dalian University of Technology, where he continues to advance research in measurement technologies. His work has garnered attention for its practical applications in various industries, enhancing the accuracy of spatial data collection.
Collaborations
Kun Liu has collaborated with notable colleagues, including Wei Liu and Bing Liang. Their combined expertise contributes to the development of innovative solutions in measurement technology.
Conclusion
Kun Liu's contributions to 3D measurement technology exemplify the impact of innovative thinking in solving complex problems. His work not only advances academic research but also has practical implications for various applications in the field.