Kun-Ku Hung

Title: Innovations of Kun-Ku Hung in Chemical Mechanical Polishing

Introduction

Kun-Ku Hung is a notable inventor based in Hemei, Taiwan. He has made significant contributions to the field of chemical mechanical polishing (CMP) through his innovative designs and methods. His work focuses on enhancing the efficiency and effectiveness of slurry dispensing in CMP apparatus.

Latest Patents

Kun-Ku Hung holds a patent for a "Slurry dispenser for chemical mechanical polishing (CMP) apparatus and method." This invention features a deformable, telescoping slurry dispenser arm that is coupled to an arcuate-shaped dispenser head. The design allows for adjustments in the number of slurry dispenser ports and the degree of curvature of the dispenser head. The arm is constructed from a series of nested tubes that slide with respect to one another, enabling pivoting and positioning to accommodate various polishing pads. This innovation ensures uniform slurry distribution, effective slurry usage, and consistent polishing profiles across different wafer polishing locations.

Career Highlights

Kun-Ku Hung is associated with Taiwan Semiconductor Manufacturing Company Limited, where he applies his expertise in CMP technologies. His work has been instrumental in advancing the capabilities of semiconductor manufacturing processes.

Collaborations

He has collaborated with notable colleagues such as Zin-Chang Wei and Huang Soon Kang, contributing to various projects that enhance CMP methodologies.

Conclusion

Kun-Ku Hung's innovative contributions to chemical mechanical polishing demonstrate his commitment to improving semiconductor manufacturing processes. His patent reflects a significant advancement in slurry dispensing technology, showcasing his role as a key inventor in this field.