Shanghai, China

Kun Hou

This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Ecolab USA Inc.. Active years: 2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kun Hou. Retrieved from https://idiyas.com/inventor/kun-hou-e4n4r9ol

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2021

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Kun Hou - Innovator in Paper Sizing Methods

Introduction

Kun Hou is a notable inventor based in Shanghai, China. He has made significant contributions to the field of papermaking through his innovative sizing methods. His work focuses on enhancing the efficiency of materials used in the production of paper.

Latest Patents

Kun Hou holds a patent for a sizing method for making paper. This method involves the addition of alkenyl succinic anhydride (ASA) during the papermaking process. Additionally, an aluminum salt is incorporated at various stages of the process. This aluminum salt is specifically chosen for its ability to generate free aluminum ions in aqueous solutions. The method not only improves the efficiency of the sizing agent and aluminum salt but also results in paper with a high moisture content.

Career Highlights

Kun Hou is currently employed at Ecolab USA Inc., where he continues to apply his expertise in the field of papermaking. His innovative approach has positioned him as a valuable asset to the company and the industry.

Collaborations

He has collaborated with notable colleagues, including Kaihong Huang and James L. Thomas, to further advance the research and development of papermaking technologies.

Conclusion

Kun Hou's contributions to the papermaking industry through his innovative sizing methods demonstrate his commitment to enhancing production efficiency. His work continues to influence the field and showcases the importance of innovation in manufacturing processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…