Taipei, Taiwan

Kun-Han Chen

This inventor holds 1 USPTO granted patent. Top assignee: Hewlett Packard Enterprise Development LP. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kun-Han Chen. Retrieved from https://idiyas.com/inventor/kun-han-chen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Kun-Han Chen: Inventor of High-Density Input/Output Technology.

Introduction

Kun-Han Chen is an inventor based in Taipei, Taiwan. His patent work includes technology for input/output devices designed for high-density or rackmount environments. He is associated with Hewlett Packard Enterprise Development LP.

Latest Patents

Chen is named on one patent, titled “Input/output device in a high density or rackmount environment.” The invention describes an input/output device that connects to one or more computing devices and includes a device unit with multiple input/output components, an internal expansion unit, and a management unit for remote administration. It also incorporates power and thermal management units to support the device’s operation.

Career Highlights

Chen’s recorded patent contribution focuses on integrating connectivity, expansion, remote management, power, and thermal functions in a high-density or rackmount input/output system. His patent record lists 1 patent.

Collaborations

Chen’s listed coworker is Han-Chung Yu. The patent is associated with Hewlett Packard Enterprise Development LP.

Conclusion

Kun-Han Chen’s patent work addresses the practical demands of managing input/output hardware in high-density computing environments, combining device connectivity and expansion with remote, power, and thermal management.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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