Company Filing History:
Years Active: 2021-2023
Title: Kuen-Shian Chen: Innovator in Semiconductor Technology
Introduction
Kuen-Shian Chen is a notable inventor based in Hsin-Chu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of integrated circuit packaging. With a total of two patents to his name, Chen's work focuses on addressing critical challenges in thermal expansion mismatch.
Latest Patents
Chen's latest patents include innovative structures and methods for reducing thermal expansion mismatch during integrated circuit packaging. One of his patents discloses a semiconductor structure that features a first metal layer over a substrate, a dielectric region, and a polymer region. The first metal layer comprises a first device metal structure, while the dielectric region is formed over this layer. The polymer region is situated above the dielectric region. The dielectric region consists of multiple metal layers and an inter-metal dielectric layer that contains dielectric material between each pair of adjacent metal layers. Each of these metal layers includes a dummy metal structure positioned over the first device metal structure. These dummy metal structures effectively shield non-overlapping portions of the first device metal structure from a top view of the semiconductor structure.
Career Highlights
Kuen-Shian Chen is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work at this prestigious company has allowed him to further develop his innovative ideas and contribute to advancements in semiconductor technology.
Collaborations
Chen collaborates with Chien-Li Kuo, a fellow innovator in the field. Their partnership exemplifies the collaborative spirit that drives innovation in the semiconductor industry.
Conclusion
Kuen-Shian Chen's contributions to semiconductor technology, particularly in reducing thermal expansion mismatch, highlight his role as a key inventor in this field. His patents reflect a commitment to innovation and excellence in integrated circuit packaging.