Company Filing History:
Years Active: 2018-2019
Title: Kuei-Seng Cheng: Innovator in Electrodeposited Copper Foils
Introduction
Kuei-Seng Cheng is a notable inventor based in Miaoli, Taiwan. He has made significant contributions to the field of materials science, particularly in the development of electrodeposited copper foils. With a total of 2 patents to his name, Cheng's work has implications for various electronic applications.
Latest Patents
Cheng's latest patents focus on an innovative electrodeposited copper foil that exhibits surprisingly low repulsive force characteristics. The copper foil is designed with specific properties, including a lightness L* value of the nodule untreated side, based on the L*a*b color system, ranging from 75 to 90. Additionally, it boasts a normal tensile strength between 40 kgf/mm to 55 kgf/mm. This technology is particularly relevant for flexible printed circuit boards and electronic devices, where the copper foils are utilized to form conductive lines.
Career Highlights
Kuei-Seng Cheng is currently employed at Chang Chun Petrochemical Co., Ltd. His work at this company has allowed him to explore and develop advanced materials that enhance the performance of electronic components. His innovative approach has positioned him as a key figure in the industry.
Collaborations
Cheng collaborates with talented individuals such as Yao-Sheng Lai and Jian-Ming Huang. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.
Conclusion
Kuei-Seng Cheng's contributions to the field of electrodeposited copper foils demonstrate his commitment to innovation and excellence. His patents not only advance material science but also pave the way for future developments in electronic applications.