The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 29, 2019
Filed:
Apr. 18, 2017
Applicant:
Chang Chun Petrochemical Co., Ltd., Taipei, TW;
Inventors:
Assignee:
CHANG CHUN PETROCHEMICAL CO., LTD., Taipei, TW;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C25D 1/04 (2006.01); C25D 1/20 (2006.01); C25D 5/48 (2006.01); C25D 3/38 (2006.01); H01M 4/04 (2006.01);
U.S. Cl.
CPC ...
C25D 1/04 (2013.01); C25D 1/20 (2013.01); C25D 3/38 (2013.01); C25D 5/48 (2013.01); H01M 4/045 (2013.01); H01M 4/0438 (2013.01); H01M 4/0469 (2013.01);
Abstract
The present disclosure relates to a copper foil that exhibits surprising low repulsive force characteristics; and to methods for manufacturing such copper foils. Typically, the copper foil has (a) a lightness L* value of the nodule untreated side, based on the L*a*b color system, in the range of 75 to 90 and (b) a normal tensile strength in the range of 40 kgf/mmto 55 kgf/mm. The disclosure further relates to flexible printed circuit boards and electronic devices using the above-mentioned copper foils for forming conductive lines therein.